Webinars

Electro Magnetic Applications, Inc. (EMA) hosts the Solving Electromagnetic Challenges series to explore proven solutions, emerging technologies, and engineering best practices for tackling today's toughest electromagnetic design problems.


Our next webinar is Wednesday, Nov. 18, 2026

Talk to Your Simulation: Agent-Driven PCB EMC and Magnetron Plasma Workflows with EMA3D Connect Plus

Setting up a simulation takes more engineering time than solving it. A PCB has to be imported, nets selected, meshed, and instrumented with sources and probes. A multiphysics study has to pass fields from one solver to the next without a lost unit or a flipped sign. Each step usually means a different GUI, a folder of files, and results assembled by hand.

EMA3D® Connect Plus exposes every public capability as a callable tool through an MCP server. Engineers bring the agent client and model their organization already approves, then describe the problem in plain language. The agent draws on EMA's engineering methods, which ship as skills, to set the study up the way EMA's own engineers would. It interviews the engineer before it acts and asks for confirmation before it commits an edit. No one clicks a button.

Join us for this webinar, where two EMA engineers show agent-driven setup on two very different problems.

  • Radiated emissions and susceptibility on a PCB. Watch an agent import a board, mesh it, raise the mesh resolution on request, and hand it to Ansys Discovery for EMC Plus. Then ask which traces are most likely to pick up crosstalk from a USB data pair. The agent reads the board, ranks the candidates by clearance and parallel run length, and places the sources and probes.
  • Ansys Maxwell to Ansys Charge Plus. See an agent build a magnetron magnet assembly in Maxwell through pyAEDT and run the magnetostatic solve. It then exports the B-field on a grid and uses it as the source for a plasma analysis in Charge Plus.
  • Learn how EMA methods are packaged as agent skills, including the failure signatures that come from real sessions, such as a coercivity sign that silently reverses a magnet or a field export in meters when the model is in millimeters.
  • Understand how the same problem definition can run on the full solver or on EMA's Physics AI surrogate, which returns shielding effectiveness up to 628x faster than the GPU solver.
  • Explore what you need to bring to try this yourself: your own agent client, your own approved model, and no customer data leaving your environment.

At the end of the webinar, attendees will have a clear picture of how agentic setup shortens the path from a design question to a trustworthy EMC or plasma result, and of how to start using it on their own problems.

Join us Nov. 18 at 1 p.m. ET.

Speaker: Gregory Wilson

EMA Senior Scientist

Gregory Wilson is a Senior Scientist at Electro Magnetic Applications, Inc. (EMA) where he specializes in space environment interactions with materials and spacecraft as well as electromagnetic effects of lightning and other high voltage phenomena. He has worked on numerous projects contracted by NASA, SpaceX, AFRL, and other space focused organizations.

Gregory received his Masters in Physics at Montana State University and his PhD at Utah State University with a focus on energetic electron interactions with Multilayer materials.

Gregory has published dozens of articles focusing on electron ranges in materials, secondary electron yield, surface voltage measurements, and other space based material characterization topics. He has recently worked on high fidelity electromagnetic simulations to understand the coupled interactions of surface and internal spacecraft charging. He is currently participating in the design and construction of EMA’s SERE facility as well as the development of Ansys Charge Plus (formerly EMA3D® Charge).

Patrick Campbell

EMA Scientist II

Patrick Campbell is a Scientist II at EMA. He attended Colorado School of Mines earning a B.S. in engineering physics and a non-thesis M.S. in data science.


View our previous webinars here:

PCBA Design Decisions and SI/EMC Consequences

PCBA Design Decisions and SI/EMC Consequences

Topic: PCBA Design Decisions and SI/EMC Consequences Presenter: Ryan French, EMA Computational Signal Integrity Engineer Abstract: When creating a PCBA, designers have a tough task – they must balance size, cost, and performance requirements, all while delivering a product that passes signal integrity and EMC tests. The decisions made during this process can significantly affect […]

Integration of Ansys EMC Plus, SIwave and HFSS

Topic: Integration of Ansys EMC Plus, SIwave and HFSS Presenter: Juliano Mologni, Principal Product Manager, Ansys by Synopsys Abstract: Solving electromagnetic compatibility (EMC) challenges often requires more than a single tool—it demands a strategic combination of technologies. At Ansys, we offer a powerful suite of solvers designed to tackle even the most complex EMC scenarios. […]

PECVD Chamber

Simulating the Future of PECVD: Better Processes, Better Devices

Topic: Simulating the Future of PECVD: Better Processes, Better Devices Presenter: Tim McDonald, EMA Principal Scientist II and Co-owner Abstract: Plasma Enhanced Chemical Vapor Deposition (PECVD) is a cornerstone of modern electronics manufacturing, yet fully capturing its complex physics through simulation has remained a significant challenge—until now. EMA has developed breakthrough, patent-pending innovations that enable […]

Ansys EMC Plus and Ansys Chagre Plus: 25R2 What's New

Ansys EMC Plus and Ansys Charge Plus: 2025 R2 What’s New

Topic: Ansys EMC Plus and Ansys Charge Plus: 2025 R2 What’s New Presenter: Kevin-Druis Merenda, EMA Principal Scientist and Product Manager Abstract: Exciting updates have arrived for Ansys EMC Plus and Ansys Charge Plus bringing new capabilities to enhance your experience. Headline new functions for EMC Plus include: Circuit at harness junctions S-parameter post-processing in […]

Introduction to Ansys STK Shield Plus

Topic: Introduction to Ansys STK Shield Plus Presenter: Kevin-Druis Merenda, EMA Principal Scientist I and Product Manager Abstract: EMA is excited to announce a new software product, Ansys STK Shield Plus. STK Shield Plus is an add-on to Ansys STK. It allows STK users to quickly address survivability concerns from the effects of electromagnetic radiation, […]

Full Vehicle Simulations for EMC, EMI, and E3 of Structures and Cables

Topic: Full Vehicle Simulations for Electromagnetic Compatibility (EMC), Electromagnetic Interference (EMI), and Electromagnetic Environmental Effects (E3) of Structures and Cables Presenter: Megan Maguire, EMA Senior Scientist Abstract: Having the ability to model and simulate a full vehicle in a given electromagnetic environment is critical throughout the design cycle of the platform. Ansys EMC Plus is […]

Full Vehicle Simulation for EMI/EMC

Topic: Full Vehicle Simulation for EMI/EMC Presenter: John Twerdock, EMA VP of Software Business Development Abstract: The automotive electronics market has grown dramatically over the past decade. Analysts estimate that 50% of the total vehicle cost will be onboard electronics by 2030! Increasingly complex automotive systems have contributed to this growth – including electric powertrains, […]

EMA’s current testing and characterization facility named SERE for space environment and radiation effects.

Space Environment and Radiation Effects Lab: Capabilities and Roadmap

Topic: Space Environment and Radiation Effects Lab: Capabilities and Roadmap Presenter: Brian Wood, EMA Senior Scientist Abstract: Testing for the harsh environment of space can be difficult, but at EMA, we’re making it a little easier. EMA’s Space Environment and Radiation Effects (SERE) lab is a space environment simulation test facility that specializes in spacecraft […]

Ansys EMC Plus and Ansys Charge Plus: 2025R1 What’s New

Topic: Ansys EMC Plus and Ansys Charge Plus 25R1: What’s New Presenter: Kevin-Druis Merenda, EMA Lead Product Manager and Principal Scientist I Abstract: The 2025R1 Release of the Electronics Plus products developed by EMA has a lot of new exciting capabilities! Multiple updates were made to the user experience in EMC Plus, including a modern […]

Validation of EMC Plus Versus Experimental Measurement in an EMC Lab

Topic: Validation of EMC Plus Versus Experimental Measurement in an EMC Lab Presenter: Tim McDonald, EMA PhD President and Co-Owner Abstract: Ansys EMC Plus is a platform-level electromagnetic modeling and simulation tool designed to deliver a comprehensive design-to-validation workflow for electromagnetic compatibility (EMC) and electromagnetic interference (EMI) issues. It specializes in analyzing electromagnetic effects on […]

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