Webinars
Take part in EMA’s Solving Electromagnetic Challenges webinar series, where you will learn how to overcome the most pressing issues in the industry. Whether it's adapting to new standards, adopting new technologies and methodologies, or optimizing your designs and workflows, Solving Electromagnetic Challenges will give you the edge you need to succeed.
Our next webinar is Wednesday, Nov. 19, 2025
PCBA Design Decisions and SI/EMC Consequences
When creating a PCBA, designers have a tough task – they must balance size, cost, and performance requirements, all while delivering a product that passes signal integrity and EMC tests. The decisions made during this process can significantly affect signal noise, power noise, and problematic emissions.
Many designers follow design rules that are informed by previous experience, company policy, or rules-of-thumb learned from other engineers. While some common design rules are well-informed, in many cases these rules can make noise and emissions worse! From stackup creation to component routing, every decision has the potential to make debugging the product’s issues more difficult. There are, however, a few decisions that can ensure that the finished board minimizes deleterious effects.
In this webinar, we will look at two identical PCBA designs – one with good design decisions and another with poor decisions. By simulating these designs, the impact of these design decisions can be clearly demonstrated. We will cover power delivery network impedances, crosstalk, edge-launched emissions, and more. By the end of the webinar, designers should recognize how the smallest decisions can change the finished board’s behavior, as well as how EMA’s team of experts can help in the design process.
Join us on Nov. 19 at 1 p.m. ET. Click here to get registered.
Speaker: Ryan French
EMA Computational Signal Integrity Engineer
Ryan French joined EMA in 2024 as a Computational Signal Integrity Engineer. His background in physics, firmware, PCBA design, and SI/EMC engineering gives him a unique understanding of electrical systems, from the smallest details to the system-level. Ryan received his bachelor’s degree in physics from Saginaw Valley State University and his master’s degree in physics from Montana State University before spending his time in the commercial aerospace sector. With his varied experience, he can tackle a wide range of E3 issues confidently while communicating the issues intuitively.
