Easier Full-Device Modeling for EMC and ESD
Topic:
Easier Full-Device Modeling for EMC and ESD
Presenter:
Tim McDonald, EMA President
Abstract:
Do you think full-device electromagnetic modeling of products is impossible? The team behind EMA3D® set out decades ago to solve this problem. This webinar on EMA3D® will describe the basic workflows and teach new users how to get up to speed in these tools quickly. We will demonstrate EMA3D® Cable’s (now Ansys EMC Plus) forgiving mesh technology that can utilize mechanical design files to quickly model enclosures and add critical details such as seams and apertures. Next, we will train users on the methods in EMA3D® Cable to create complex cable harnesses quickly and easily that are complete with shields, branches, and connectors. We will demonstrate the ability of EMA3D® Cable to quickly process simulation data to create results that can be easily compared to EMC limit curves followed by a demonstration of how EMA3D® Cable can import fields from printed circuit board and antenna simulations. The fields will drive enclosures with cables and seams that are quickly specified based on mechanical drawing import. Next, we will introduce EMA3D® Charge, which has a unique ability to simulate non-contact electrostatic discharge (ESD) arcs in air using co-simulation of the electromagnetic, fluid, and air equations simultaneously. By the end of this webinar we will prove how full-device electromagnetic modeling is possible!
