3D Plasma Simulations for PECVD, Sputtering, Etching, and more in Ansys Charge Plus
Topic:
3D Plasma Simulations for PECVD, Sputtering, Etching, and more in Ansys Charge Plus
Presenter:
Kevin-Druis Merenda, EMA Lead Software Product Manager
Abstract:
EMA has decades of simulation, consulting, and experimental experience in plasma physics and electromagnetics. We developed state-of-the-art numerical solutions to solve complex engineering problems related to radiation hardening (very-high-energy very-low-density plasmas), spacecraft charging (low-energy low-density plasmas), and electrostatic discharge (high-energy high-density plasmas). These numerical solutions are at the heart of Ansys Charge Plus, an end-to-end simulation software that allows users to leverage the physics efficiently with an optimized user interface for simulation setup, execution, processing and analysis.
We quickly realized that our Multiphysics simulation tool, Ansys Charge Plus, could be expanded by adding key capabilities to our advanced physics solvers to simulate plasmas at energies and densities beyond previously capable. As of this year, we can solve all types of plasmas by combining our finite-element full-wave time-domain electromagnetic solver with a particle-in-cell solver, a new computational-fluid-dynamic solver, and a new gas-reaction solver.
For this webinar, we want to showcase how our new capabilities can benefit plasma applications across numerous industries, and more specifically that of the semiconductor manufacturing industry, where Multiphysics is associated with large spatial and temporal scales, but also with large variations in energy and density of charged particles. We will demonstrate how we can accurately solve 3D plasma dynamics in PECVD, Sputtering, and Etching chambers, in a timely manner – both on the simulation setup front but also on the computational front. Leveraging Ansys Charge Plus and its integrations across the Ansys simulation portfolio, EMA is able to support your engineering team with simulation to answer tough questions related to manufacturing quality, efficiency and design.
