2021 R2 Ansys EMC Plus: Faster EMC Solving for Electronic Devices and Entire Vehicles

FDTD sub grid modeling

Topic:

2021 R2 Ansys EMC Plus: Faster EMC Solving for Electronic Devices and Entire Vehicles

Presenter:

Tim McDonald, EMA President

Abstract:

This webinar showcases how the new features in EMA3D® Cable (now Ansys EMC Plus) help you tackle Electromagnetic Interference (EMI) challenges including radiated emissions, radiated immunity, electrostatic discharge (ESD), and interference between systems integrated on a device or large platform.

Preview some of the new features:

  • Ability to import Ansys SIwave near fields for printed circuit boards (PCBs) into EMA3D® Cable models that contain enclosures, cables and other complex structures.
  • Frequency-dependent materials that allow for analysis of complex materials within electronics enclosures.
  • Thin material algorithm that accurately captures the shielding effects of a wide range of materials with minimal geometric manipulation.

Full Webinar Video:

 

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