Take part in EMA’s Solving Electromagnetic Challenges webinar series, where you will learn how to overcome the most pressing issues in the industry. Whether it's adapting to new standards, adopting new technologies and methodologies, or optimizing your designs and workflows, Solving Electromagnetic Challenges will give you the edge you need to succeed.
Our next webinar is Wednesday, Jan. 22, 2025
PCBA Designs: Importance of Early SI & EMI Reviews
The past several decades has shown incredible progress in the manufacturing of smaller, faster, and more efficient integrated circuits (ICs). These improvements have been welcomed by printed circuit board assembly (PCBA) designers as they mean board designs can be more compact and can achieve switching rates that are quick enough to handle the ever-increasing demand for faster communications.
Despite these positive developments, an often-overlooked aspect of the design cycle is critically examining harmful signal integrity (SI)/ electromagnetic interference (EMI) side effects. A typical modern PCBA design may contain tens to hundreds of fast-switching ICs, some with hundreds of switching pins. This makes modern designs increasingly susceptible to issues such as crosstalk, power rail noise, ringing, and emissions. These problems will only become more prevalent as ICs continue to increase in speed, meaning that good design practices are crucial.
With careful expert review and simulation, problematic design decisions can be mitigated earlier in the design cycle, saving designers critical time and money. In this webinar, we will discuss: • Design issues leading to SI and EMI problems • Misconceptions about proper PCBA layout • EMA’s design review capabilities and analysis
Attendees can expect to learn how EMA’s SI and EMI design review process is the best way to ensure performance, to minimize prototyping, and reduce testing costs
Join us on Jan. 22 at 1 p.m. ET/ 11 a.m. MT. Click here to get registered.
Speaker: Ryan French EMA Computational Signal Integrity Engineer Ryan French is a Computational Signal Integrity Engineer at Electro Magnetic Applications, Inc. (EMA®). Ryan has a varied background in theoretical physics, PCBA design for aerospace applications, and signal integrity/electromagnetic interference. Ryan received his bachelor’s degree in physics at Saginaw Valley State University and his master’s degree in physics from Montana State University. With his understanding of PCBA design, he specializes in the review of circuit designs, from the schematic stage to the fabrication and assembly stages.
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