EMC Plus and Charge Plus Technical Session
Original Research Presentations:
- Electromagnetic Compatibility (EMC) of devices with cables, Printed Circuit Boards (PCBs), and enclosures
- Electromagnetic Compatibility (EMC) of full vehicles with complex cable interconnect systems
- RF De-sense of electronic devices
- Plasma-Enhanced Chemical Vapor Deposition (PECVD) for semiconductor processing
- Simulation of MIL-STD-461 and DO-160 in units and enclosures
- Arc extinction and RF plasmas for current interruption
- Electrostatic Discharge (ESD) in electronic devices
Technical Demonstrations:
We invite authors to submit abstracts for demonstrations, tutorials, and discussion of the state-of-the-art technologies in the topic area of software.
Important Dates:
Abstract Deadline: Jan. 1, 2025
Author Instructions:
All text must be double spaced with 12-point Arial font. Footnotes, bibliographic references, and long quotations may be singled spaced, but double spaced between entries. Each page must be labeled with a page number on the bottom or top of the page.
An abstract may not exceed 500 words and should include the following:
- Title (not included in word count)
- Objective(s)
- Background
- Methods (research methods or innovation approach)
- Results and Conclusions (research results or innovation impact)
- References (optional, up to five; does not count towards word count)
Authorship:
Papers will be published to the public and must abide by authorship standards.
Authorship of paper should be limited to those individuals who have contributed in a meaningful way to its intellectual content. Speakers are responsible for crediting co-authors and references to ensure ethical standards in all publications which they will be listed as an author.
Abstracts do not have to be new publications.
Submit your abstracts by sending an email to ema.expo@ema3d.com.
